1731-A13-58-3

0.8mm High Speed Board Socket Hybrid power type ZPin(Power)+40Pin(Signal), Vertical PIP+SMT with positioning column lower plate size 2.35,mylar adsorption, Roll bag packaging contact plating Au0.76μm Sn LCP Black

1886-036-08-3

CONN PCI EXPRESS 4.0 Pitch 1.00mm 36POS SMT Contact Plating Au 0.76μm Sn LCP Black UL94V-0 surface-mount with positioning column

1886-036-38-3

CONN PCI EXPRESS Pitch 1.00mm 36POS Straight Solder Contact Plating Au 0.76μm Sn LCP Black UL94V-0 with lower plate size 3.1

1886-064-08-3

CONN PCI EXPRESS 4.0 Pitch 1.00mm 64POS SMT Contact Plating Au 0.76μm Sn LCP Black UL94V-0 surface-mount with positioning column

1886-064-38-3

CONN PCI EXPRESS Pitch 1.00mm 64POS Straight Solder Contact Plating Au 0.76μm Sn LCP Black UL94V-0 with lower plate size 3.1

1886-098-08-3

CONN PCI EXPRESS 4.0 Pitch 1.00mm 98POS SMT(Standard Structure) Contact Plating Au 0.76μm Sn LCP Black UL94V-0 surface-mount with positioning column

1886-098-38-3

CONN PCI EXPRESS Pitch 1.00mm 98POS Straight Solder Contact Plating Au 0.76μm Sn LCP Black UL94V-0 with lower plate size 3.1

1886-164-08-3

CONN PCI EXPRESS 4.0 Pitch 1.00mm 164POS SMT Contact Plating Au 0.76μm Sn LCP Black UL94V-0 surface-mount with positioning column

1886-164-38-3

CONN PCI EXPRESS Pitch 1.00mm 164POS Straight Solder Contact Plating Au 0.76μm Sn LCP Black UL94V-0 with lower plate size 3.1

1886-165-08-3

CONN PCI EXPRESS 1.00mm X16(164POS) 32G/REV 5.0 SMT Contact Plating Au 0.76μm Sn LCP Black UL94V-0 surface-mount with positioning column